Asic and foundry service specialist, Redtree Solutions has signed an agreement with Agile Analog, making the latter’s configure IP available as part of the RedASIC custom chip design service.
Asic and foundry service specialist, Redtree Solutions has signed an agreement with Agile Analog, making the latter’s configure IP available as part of the RedASIC custom chip design service.
SAN JOSE, Calif.--(BUSINESS WIRE)--ArkX Laboratories, a leading provider of advanced far-field voice-capture technology, has appointed Redtree Solutions, the largest Pan-European electronic representative in the semiconductor industry, as the exclusive sales representative for its production-ready EveryWord™ voice solution in the Europe, Middle East and Africa (EMEA) marketplace.
Apollo System- on-Chip with MRAM captures SOC Category
Integrated charge pump delivers >92% efficiency with 3V LI coin cell battery in IoT applications
MILPITAS, CA: October 27, 2020 – Lumissil Microsystems, a division of ISSI, today announced the release of the IS31FL3197, a feature rich upgrade to the previously announced 4-channel LED driver IS31FL3195. The IS31FL3197 integrates a high-efficiency charge pump for operation down to 2.0V, a crossfade engine to create smooth color transitions and a programmable self-running pattern generator for automated RGBW lighting effects. With the introduction of this new device, Lumissil further expands its LED driver presence in energy saving markets for Internet-of-Things (IOT), wearable and battery operated devices.
SAN JOSE, Calif. and GUANGZHOU, China -- September 21, 2020 - GOWIN Semiconductor Corp., the world’s fastest-growing programmable logic company, releases the latest version of their GoAI machine learning platform, providing an SDK and accelerator to perform machine learning for edge inference using convolutional neural networks on GOWIN FPGAs. GOWIN GoAI 2.0 offers direct integration into the TensorFlow and TensorFlow Lite Machine Learning Platforms, optimization for targeting GOWIN’s GW1NSR4P µSoC FPGA, and an accelerator to offload compute-intensive functions from the microcontroller embedded within GOWIN FPGAs with additional 80x performance.
MILPITAS, Calif., June 26, 2020 -- Lumissil Microsystems, a division of Integrated Silicon Solution, Inc. (ISSI), announced today Redtree Solutions as its’ new manufacturer’s representative for France and Russia as well as Iberia on a limited product portfolio excluding connectivity
MIAMI – September 21, 2020 – Raltron Electronics, a global leader in high performance frequency management components and antenna products, is pleased to announce the appointment of Redtree Solutions as its new manufacturer’s sales representative for France and Benelux (Belgium, Netherlands and Luxemburg). Redtree will support Raltron’s entire product line including crystals, oscillators, VCXO, TCXO, OCXO, VCO, LTCC filters, antennas, and RF cable assemblies.
The CT110 a plug-and-play device for current monitoring applications requiring high linearity, high resolution, miniature form-factor, isolation, and design simplicity.
The CT310, a robust TMR 2D sensor, is targeted for applications that demand contactless, high accuracy angular position detection
Qorvo® Recognizes Top IDP Sales Representatives and Distributors for 2020
Greensboro, NC, May 22, 2020 – Qorvo® (Nasdaq: QRVO), a leading provider of innovative RF solutions that connect the world, today announced the winners of its 2020 Sales Awards in support of its Infrastructure and Defense Products (IDP) business.
These awards recognize Qorvo’s distributors and external sales representatives whose contributions to Qorvo IDP’s growth and/or customer technical support exceeded expectations during the past year.
Winners were recognized during the 2020 IDP Global Sales Conference, an annual training and networking event held virtually this year, and were chosen from nominations by Qorvo's executive sales team. Qorvo's distributor and external sales representative team strengthens the company's leadership in fast-growing markets for cellular and broadband networking, the Internet of Things, and defense and aerospace applications.
The categories and winners included :
Global Distributor of the Year – Grit Award: Midoriya
Global Distributor of the Year – Resilience Award: RFMW
Representative Sales Person of the Year: Ralf Becker of Redtree Solutions
Representative Firm of the Year: dBm Technical Sales
Qorvo (Nasdaq: QRVO) makes a better world possible by providing innovative Radio Frequency (RF) solutions at the center of connectivity. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves diverse high-growth segments of large global markets, including advanced wireless devices, wired and wireless networks and defense radar and communications. We also leverage unique competitive strengths to advance 5G networks, cloud computing, the Internet of Things, and other emerging applications that expand the global framework interconnecting people, places and things. Visit www.qorvo.com to learn how Qorvo connects the world.
Qorvo is a registered trademark of Qorvo, Inc. in the U.S. and in other countries. All other trademarks are the property of their respective owners.
See how Redtree's Partner, Ambiqmicro, will enable AI endpoints at never achieved yet power consumption. Please contact Redtree Solutions from Europe if you want to learn more about Ambiq'sAI endpoints processing/connectivity solutions.
The design of modern Application Specific Integrated Circuits (ASICs) and Systems on a Chip (SoCs) in advanced process nodes can be differentiated by the on-die integration of analog functions, such as power management. Vidatronic offers this white paper to give some historical background on this trend and delve specifically into the integration of power management. Vidatronic IP solutions and the benefits they bring to ASIC and SoC designers are discussed.
We are welcoming you to our Parade/Redtree webinar for customers to learn more about PCIe 4/5 and retimers/redrivers. Please, see below the agenda and link to register.
Silicon Valley lidar specialist Cepton Technologies names Redtree Solutions as European technical sales representative.
College Station, TX – 05 DECEMBER 2019 -- Vidatronic, Inc., a leading provider of analog Intellectual Property (IP) licenses including power management unit (PMU), CMOS radio frequency (RF), and LED driver solutions for system on a chip (SoC) integration, is delighted to have Michael Nix now serving as Chief Technology Officer (CTO) of the company.
MediaTek is collaborating with Redtree Solutions - the largest pan-European representative company in the Semiconductor Industry – to maximize the growth opportunity for Rich IoT adoption in Europe. Redtree Solutions is a specialist in technical sales of semiconductor solutions, covering 19 countries through Europe.
Microchip announces two new solutions that simplify USB Type-C PD designs to remove the traditional complexity and high costs associated with implementing USB Type-C in a range of applications.
Vidatronic Press Release
College Station, TX – 02 JULY 2019 -- Vidatronic, Inc., a leading provider of analog, power management unit (PMU) and CMOS radio frequency (RF) Intellectual Property (IP) licenses, today announced the release of the latest addition to their Power Quencher® series, the VLDS0300LS130, a low dropout (LDO) voltage regulator IP core optimized for battery-powered devices where low power is critical.
Vidatronic Inc., a leading provider of power management and CMOS radio frequency (RF) power amplifier Intellectual Property (IP) solutions, announces a new series of integrated power management unit (PMU) IP cores silicon-proven in the TSMC 40 nm process. The PMU IP cores are optimized for integration into Application Specific Integrated Circuits (ASICs) or Systems-on-a-Chip (SoCs), including radio frequency (RF), wireless, and narrowband Internet of Things (NB-IoT) applications.
UltraSoC, the leading provider of embedded analytics IP and software, today announced the appointment of Redtree Solutions as its technical sales representative in Europe, to support a growing opportunity for UltraSoC’s embedded analytics particularly within automotive, and other safety- and security-critical applications. A team from Redtree will join UltraSoC at the upcoming Embedded World 2019 event (Booth 3A 536, 26-28 February, Nürnberg, Germany).
Telechips strengthens its sales offering by integrating Synamedia VideoGuard, trusted by the video industry’s most respected brands and platforms
College Station, TX – 4TH SEPTEMBER 2018 -- Vidatronic, Inc. today announced the appointment of Redtree Solutions as the distributor of its proprietary power management and CMOS radio frequency (RF) intellectual property (IP) cores and design services in European and Middle-Eastern marketplaces.
We are pleased to invite you as our valuable customer to come for visiting
Telechips IBC Roadshow - September 14 - 18, 2018.
Telechips CE Business unit will be looking forward to sharing Telechips’ new features that outperform
current solutions available in the market.
Venue: RAI Amsterdam (Stand No. BS7)
Europaplein 2, 1078 GZ Amsterdam
+31 20 549 1212
Date: 14-18 Sept. 2018
We are looking forward to meeting you at the event.
Langen/Germany, 6. June, 2018 --- Socionext Inc., a leading provider of SoC-based imaging solutions, collaborated with Primax Electronics Ltd. and developed the world’s smallest and thinnest 360-degree camera module that features Socionext’s Milbeaut® series of image signal processor.
We are very pleased to announce our pan-European cooperation with Finisar, the world's largest supplier of optical communication products.
We would like to invite you to preview the latest and most advanced video- and image-processing semiconductor solutions from Socionext during NAB 2018 in Las Vegas in our private meeting room.
Langen/Germany, January 22, 2018 - Socionext Europe is pleased to announce the appointment of Redtree Solutions to act as representative for Northern Europe (Nordic, Benelux, Netherlands) and France.
Langen/Germany, January 10, 2018 --- Socionext Europe will be exhibiting the world’s smallest, lightest 8K Media Player and other resolution technologies at Integrated System Europe (ISE) in Hall 5, Stand V30, at RAI Amsterdam from 6 – 9 February.
MILPITAS, Calif., Jan. 16, 2018 (GLOBE NEWSWIRE) -- Open-Silicon, a system-optimized ASIC solution provider and long-standing member of TSMC’s Value Chain Aggregator (VCA) and Design Center Alliance (DCA) programs, today announced it was presented with TSMC’s OIP Ecosystem Forum 2017 Customers’ Choice Award for best paper.
Cirrus Logic Accelerates Design of Next Generation Voice-Enabled Devices with Voice Capture Development Kit for Amazon Alexa Voice Service
Preston Bissett, UK– June 12th, 2017 – Redtree Solutions, the largest pan-EMEA manufacturer’s rep company today announced it was selected by GreenWaves Technologies to represent them and to promote their first product GAP8, industry’s first IoT processor. Redtree Solutions will provide GreenWaves Technologies with its unique pan-european network of sales and application support.
Headquartered near Grenoble, France, GreenWaves Technologies is a fabless semiconductor company. Their GAP8 device is an ultra-low power smart IoT processor, based on the open-source PULP and RISC-V projects, that can analyze and classify rich data produced by image, sound and motion sensors. It can operate for several years on a single battery. Its 1+8 extended RISC-V ISA cores, combined with a convolutional neural network engine, provides very high processing power that is uniquely energy efficient and easy to program. Furthermore, GAP8 presents a cost breakthrough for mid-range machine vision solutions.
“Redtree Solutions’ track records in design creation for application specific processors combined with its ecosystem approach is a great fit for the promotion of our first device GAP8.” said Loic Lietar, Co-Founder and CEO of GreenWaves Technologies. “On top, Redtree’s ecosystem is helping us meeting our goals along the supply chain of our device. FPGA application demos of GAP8 are available to customers today and GAP8 development boards & tools will be available in September 2017.”
“We are very excited to work with GreenWaves Technologies to complement our application processor offer for Industrial IoT applications combining very high level performances and ultra low power with the GAP8 processor” said Jean Marie Houillon, VP Marketing & Alliances of Redtree Solutions Ltd. GAP8 will enable battery powered MIPS consuming vision applications with the possibility to combine many other sensing features on top, providing our industrial customers with a solution to meet there needs today and far into the future.
About GreenWaves Technologies
GreenWaves Technologies is a fabless semiconductor company that develops GAP8, the industry’s first IoT processor. Thanks to its extreme energy efficiency, GAP8 enables smart IoT battery-powered applications, such as image classification, people counting, machine health monitoring and many more. To learn more, please visit www.greenwaves-technologies.com
About Redtree Solutions Limited
Redtree Solutions is the largest pan-EMEA manufacturer’s rep company with focus on demand creation at the main actors of Europe electronics Industry. The company has established sales offices in each of the major EMEA territories including UK, Scandinavia, France, Benelux, Spain/Portugal, Germany, Italy, Turkey and Israel.
We represent leading edge semiconductor manufacturers and aim to provide our customers with market-defining, innovative and reliable solutions. Our focus is on synergistic technologies that allow us to provide optimized solutions to customer needs. Our mission is to add significant value to our customers’ applications by offering early access to our complete ecosystems combining competitive and advanced technology.
Redtree Solutions has an exceptional level of demand creation focus and serves the Telecom, Consumer, Enterprise, Automotive, Industrial and Aerospace & Defence market places. For more information please visit www.redtree-solutions.com
+33 6 86 86 78 44
XVF3000 devices and development kits target voice-enabled speakers
BRISTOL, UK — JUNE 13th, 2017—XMOS Ltd (www.xmos.com), a leading supplier of voice solutions for IoT products, today announces the launch of the XVF3000 family of voice processors, which provide class-leading far-field voice capture using arrays of MEMS microphones. With optional support for Sensory’s TrulyHandsfree™ technology, the industry’s leading voice-trigger solution, the XVF3000 family provides the most flexible and cost effective always-on voice interface in a single device.
XMOS also announces the availability of the VocalFusion™ Speaker development kit (XK VF3100 C43), which includes an XVF3000 processor card and a 4-mic circular microphone array. This kit provides a quick way to start developing far-field voice capture applications.
"Today is a very significant day for XMOS. We’re introducing XVF3000 and VocalFusion™ Speaker as the first in a range of voice capture products. Based on our powerful and flexible xCORE microcontroller architecture, XVF voice processors open up new possibilities for designers looking to deliver high performance voice capture in a very cost-effective form factor," said Mark Lippett, CEO at XMOS. "We're excited to be at the forefront of the revolution driven by products like Amazon Echo and Google Home, which have shown the possibilities for voice interfaces. We are working worldwide with customers and partners to accelerate the adoption of voice as the interface of choice for the Internet of Things."
XVF3000 devices include speech enhancement algorithms that include an adaptive beamformer, which uses signals from four microphones to track a talker as they move, coupled with high performance full-duplex, acoustic echo cancellation. XVF3000 devices can be easily integrated with an applications processor or host PC via either USB for data and control or a combination of I2S and I2C. Developers can quickly add custom voice and audio processing using the XMOS free development tools.
XVF3000 devices are available immediately from XMOS, and the VocalFusion™ Speaker Development Kit will be available in July 2017. In the meantime, developers can register for early access to our Beta program and download further information at: www.xmos.com/xcorevocalfusion.
XMOS is a leading provider of voice interface solutions. Now on its second generation of technology, the VocalFusion™ family of voice processors is pushing the boundaries of quality and integration - delivering the most comprehensive Voice User Interface (VUI) controller solutions for IoT devices.
For more information, please visit www.xmos.com.
CS7250B and CS7257B High-Performance Digital MEMS Microphones Set New Standard for Audio Performance and Drop Power Consumption to Half of Competitive Products
AUSTIN, Texas – May 17, 2017 – Cirrus Logic today introduced a pair of digital MEMS microphones that achieve best-in-class audio performance and power consumption in a compact 3.5 x 2.65 mm package. Boasting a 66 dB signal-to-noise ratio at 650 µA current consumption and an acoustic overload point of 131 dB Sound Pressure Level (SPL), the CS7250B supports the lowest noise and the lowest power consumption in the industry. The wide dynamic range between the noise floor and acoustic overload point enables high-fidelity audio recording in both quiet and loud environments.
With more than 100 dB of dynamic range, the microphones allow low-level audio content such as classical music or voice to be recorded without background hiss, while also ensuring that very loud sounds such as rock concerts and wind noise don’t cause distortion in the microphone. The CS7250B also includes an ultra low power mode, consuming just 160 uA of current at 62 dB signal-to-noise ratio, less than half the current of competitive microphones. This low power mode has been optimized for always-on voice control applications and trigger-phrase detection.
Cirrus Logic’s CS7257B includes the same performance and features as the CS7250B and is the company’s first microphone compatible with the MIPI Alliance SoundWire® standard. SoundWire is a next generation multi-device, bi-directional data and control bus being deployed in smartphones, personal computers and other consumer electronics devices. It offers fewer wires for audio signal routing and enables microphones to communicate with and be controlled by the host processor for the first time. Future microphones from Cirrus Logic will leverage the SoundWire interface, together with Cirrus Logic’ smart codecs and SoundClear® software solutions, to deliver significant improvements in system level performance, new features and power consumption benefits.
“Customers are demanding microphones that deliver higher performance at lower power to simultaneously improve the sound quality and lengthen the battery life of their products,” said Brad Fluke, vice president and general manager of Cirrus Logic’s MEMS Microphone Division. “The CS7250B is our highest performance microphone, offering superior audio quality on the input, while significantly lowering microphone power for always-on voice detection. The SoundWire interface that we’ve included on the CS7257B is an important step forward for audio system optimization. With the inclusion of these advanced digital microphones, customers can utilize our complete line of audio products to optimize their audio systems for superior overall performance.”
Packaging and Availability
CS7250B and CS7257B samples are available now in 3.5 x 2.65 x 0.98 mm bottom port LGA packages.
Cirrus Logic, Inc.
Cirrus Logic is a leader in high performance, low-power ICs for audio and voice signal processing applications. Cirrus Logic’s products span the entire audio signal chain, from capture to playback, providing innovative products for the world’s top smartphones, tablets, digital headsets, wearables and emerging smart home applications. With headquarters in Austin, Texas, Cirrus Logic is recognized globally for its award-winning corporate culture. Check us out at www.cirrus.com.
Cirrus Logic, Cirrus and SoundClear are trademarks of Cirrus Logic Inc. All other product names noted herein may be trademarks of their respective holders. © 2017 Cirrus Logic, Inc. All rights reserved.
Press Release - Sensor-driven system-on-a-chip lighting family expands to speed OEM and market adoption of variable-CCT and daylight-responsive LED lighting
Premstaetten, Austria (28 March, 2017) -- ams (SIX: AMS), a leading worldwide supplier of high performance sensor solutions, today announced the AS7225 tunable-white lighting smart system
sensor, further broadening the solution set for sensor-integrated tunable-white lighting solutions.
With the addition of the AS7225, OEM lighting manufacturers can access ams’ closed-loop CCT tuning and daylight compensation, while retaining the existing host microprocessor architecture in their smart lighting design. The result is higher precision, more flexible LED binning, and lower system costs for tunable white lighting systems.
Redtree Solutions and Open-Silicon, a system optimized ASIC solutions provider, will be glad to welcome you on Open Silicon’s booth at the Embedded World 2017 Nuremberg, Germany between 14 – 16 March 2017 to demonstrate the company’s Custom Silicon and Gateway Platform for Smart Cities, 2.5D SoC demo along with Comprehensive HBM2 IP Sub-System Solution.
Please visit us at booth 3-641 in exhibition hall 3 for viewing the demos and learning about company’s other innovative ASIC/SoC solutions.
1. Custom Silicon and Gateway Platform for Smart Cities – Company will be demonstrating end-to-end communication between edge devices / sensor hubs, gateway and cloud. The gateway platform is designed for smart city applications, which includes Smart Homes, Smart Waste Management, Smart Transport, Smart Traffic, Smart Parking, Smart Lighting, Smart Metering, etc. At its booth, company will be demonstrating Smart Lighting and Smart Parking in action.
2. Comprehensive HBM2 IP Sub-System Solution – The solution is now available for 2.5D ASIC design starts and as licensable Intellectual Property (IP). Open-Silicon’s IP is fully complying with the HBM2 JEDEC® standard. The IP translates user requests into HBM command sequences (ACT, Pre-Charge) and handles memory refresh, bank/page management and power management on the interface. The IP includes the PHY and custom die-to-die IO needed to drive the interface between the logic-die and the memory die-stack on the 2.5D Interposer.
3. 2.5D SoC Solution – This platform demonstrates a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded dual core 1GHz ARM® Cortex®-A9 ARM processors, connected across a 2.5D silicon interposer.
When and Where:
Booth 3-641 in exhibition hall 3
90471 Nürnberg, Germany
Date & opening times:
14 – 16 March 2017
09:00 – 18:00 (14 and 15 March)
09:00 – 17:00 (16 March)
Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design – architecture, logic, physical, system, software, IP – and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies, ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 125 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world.
ENS210 enables portable and connected smart home devices to improve performance and implement valuable new features
Premstaetten, Austria (8 November, 2016) -- ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today launched the ENS210, a single-die sensor IC providing extremely accurate, pre-calibrated measurements of relative humidity and ambient temperature. The ENS210 is on display for the first time at the ams stand A5.107 at the Electronica trade show
(Munich, 8-11 November 2016).
The ENS210 provides a digital temperature output in Kelvin, accurate to a maximum ±0.2°C over the range 0°C to 70°C. It also provides relative humidity measurements as a digital output accurate to a maximum ±3.5%. Shipped to customers as a calibrated unit, the sensor requires no trimming on the production line. It provides its digital outputs over an I2C interface, eliminating the need for signal processing by the host device’s applications processor or microcontroller.
Housed in a molded plastic surface-mount package measuring just 2mm x 2mm x 0.75mm, the ENS210 is small enough to be accommodated in smart phones and wearable devices including fitness monitoring wristbands.
Drawing just 40nA in stand-by mode and 7.1µA in active measurement mode (sampling at 1Hz), the ENS210 drains very little energy from the battery in handheld and portable applications. It operates from a wide input voltage range of 1.71V-3.6V, which means that systems with a dual 1.8V/3.3V power supply need no additional level-shifting voltage regulator at the point of load.
In wearable devices, the ENS210’s readings of relative humidity and ambient temperature may be used to enhance the accuracy and reliability of measurements of physical activity that are highly dependent on environmental conditions. It can also be used to add sophisticated automation or performance-enhancement features to thermostats and to connected home appliances such as air conditioning and purifiers systems, refrigerators, clothes dryers, microwave ovens, kitchen air extractors and weather stations.
The device may also be used alongside the ams CCS811 or CCS801 gas sensor ICs, which measure volatile organic compounds (VOCs) in ambient air, to provide a complete system solution for indoor air quality monitoring. ams provides application software and a development board to enable OEMs to integrate the ams environmental sensor solutions rapidly into end product designs.
‘By integrating relative humidity and ambient temperature sensing functionality in a single small IC, ams is helping consumer electronics OEMs to improve the performance of their products, and to offer new features that users find valuable, while occupying a tiny piece of real estate on what are often densely populated boards’, said Giovanni de Majo, Senior Marketing Manager at ams. ‘In addition, the ENS210 offers a user-friendly digital output which places no additional processing burden on the applications processor or MCU.’
The ENS210 is available now in production volumes. Unit pricing is US$1.9 in order quantities of 100.
An evaluation board for the ENS210 is available from the ams ICdirect online store. For more technical information, go to www.ams.com/ENS210
CCS811 and CCS801 evaluation kits with on-board relative humidity/temperature sensor are simple to set up and operate with PC-based user software
Premstaetten, Austria (15 November, 2016) -- ams AG (SIX: AMS), a leading provider of high performance sensors and analog ICs, today introduced two new evaluation kits intended for designers who wish to integrate a compact, low-power indoor air quality (IAQ) monitoring circuit into portable devices such as smartphones + wearables and home + building automation devices such as thermostats and IP cameras.
The CCS811-LG_EK_ST kit combines two environmental sensors from ams:
> the CCS811, a gas sensor system-on-chip (SSoC) uses low-power sensor technology to detect volatile organic compounds (VOCs) in an indoor environment. The CCS801-DF_EK_ST kit features a CCS801 VOC gas sensor with an external MCU instead of a CCS811.
> the ENS210, a relative humidity and temperature sensor IC which achieves very high accuracy
The CCS811 includes an embedded microcontroller which runs ams algorithms to convert raw sensor readings into equivalent total VOC (ppb) and equivalent CO2 (ppm) measurements.These can be used to provide a measure of IAQ. The measurements of relative humidity and temperature taken by the ENS210 allow the system to adjust the digital output of the CCS811 by compensating for changes in the ambient environment.
Used together with the ams algorithms, the CCS8x1 and ENS210 sensors provide a complete solution for IAQ monitoring which consumes little power and has a very small board footprint, making it suitable for a wide range of portable applications.
The new evaluation kits provide a simple way to configure and operate the sensor system, and to log and view its measurements. Each kit consists of a sensor board with an I2C digital interface, a USB-to-I2C board and a USB cable. The board is supported by a free graphical user interface for a PC based on the Windows® operating system.
Designers can start up the CCS8x1/ENS210 sensor board within minutes simply by plugging the kit into a PC’s USB port and launching the downloadable GUI software. In the GUI, users can choose one of three pre-defined operating modes: sampling at 1s, 10s or 60s intervals. Graphs of raw sensor data, relative humidity and temperature measurements, equivalent total VOC and equivalent CO2 levels are logged and displayed in the GUI.
“Consumer demand for information about the quality of the air we breathe indoors is growing fast. The CCS8x1 and ENS210 offer a solution for IAQ monitoring which is small and compatible with battery-powered systems. These new evaluation kits from ams make it easy for designers to model the system’s operation and to verify that it produces consistent, reliable IAQ information in the application’s intended operating environment”, said Paul Wilson, senior marketing manager at ams.
For more information about the evaluation kits, please visit www.ams.com/gas-sensors/CCMOSS-evalkits.
CMV50000 features low noise, high frame rate, and high dynamic range; easy-to-design-with sensor excels in automated optical inspection systems, machine vision uses and prosumer video applications
Premstaetten, Austria (7 November, 2016) -- CMOSIS a member of the ams AG (SIX: AMS) group, a leading provider of high performance sensors and analog ICs, today launched the CMV50000, an industry first global shutter CMOS image sensor offering high resolution of 48Mpixels, more than twice the resolution of its previous generation CMOSIS global shutter CMOS image sensors.
The CMV50000 is a medium format 48Mpixels sensor with 7920 x 6002 4.6-µm sized pixels using the patented 8-transistor pixel architecture to offer low noise and excellent electronic shutter efficiency. Global shutter operation means, that images of fast-moving objects can be captured without distortion.
Its pixel offers 64dB optical dynamic range at full resolution and up to 68dB in subsampled 4k mode, and the imagers benefits from the implementation of sophisticated new, on-chip noise-reduction circuitry such as black level clamping to enable it to capture high quality images under low-light conditions.
Operating at a fast 30 frames/s with 12 bit pixel depth at full resolution or a binned 4k mode, and at up to 60 frames/s with pixel subsampling to 4k resolution, the sensor is suitable for use in high-speed machine-vision systems, as well as in TV broadcasting and video cameras.
The CMV50000 provides detailed views of a large surface area required in factory automation applications such as automated optical inspection (AOI) systems and systems for the inspection of displays of mobile phones, tablets, laptops and TVs. The combination of high frame rate and high re-solution allows further increase of the already high throughput rates at consumer product assembly plants.
A High Dynamic Range (HDR) mode is supported by an odd/even row dual-exposure operation.
The CMV50000 is expected to replace high pixel-count charge-coupled device (CCD) image sensors used in machine-vision cameras and high-end security cameras. Compared to the older CCD sensor technology, CMOS image sensors are easier to integrate in camera designs, use less power, and can operate at much higher frame rates.
“The introduction of the 48Mpixel CMV50000 gives camera manufacturers the opportunity to enjoy the design and operating advantages of a CMOS image sensor while gaining the ultra-high resolution, which has previously only been available through the use of CCD sensors”, said Wim Wuyts, Marketing Manager for image sensors at ams.
“The CMV50000’s advanced noise-reduction features such as black level clamping combined with its high optical dynamic range, results in high picture quality at full operation speed without the need for complex analog output matching required for multi-tap CCD image sensors and therefore also decreases the camera development time significantly.”
The monochrome version of the CMV50000 is sampling now. The color version will be available for sampling by the end of 2016. Unit pricing is €3,450.
For sample requests or more technical information, go to https://www.cmosis.com/products/product_detail/cmv50000.
The CMV50000 is on display at the CMOSIS stand, Hall 1.H46, at the Vision exhibition (Stuttgart, 8-10 November).