NEWS & EVENTS

GOWIN Webinar where we will introduce our new Metrics Dsim Cloud simulator capability to your diaries. Date: November 16th – 3 session start times

Today, almost all our information is being digitized. Out of this, the resulting expansion of data is forcing us to reimagine our data centers at the hardware and systems levels. Here, an emerging trend is the rise of the SmartNIC: a programmable accelerator that helps offload an increasing number of tasks from the server CPU.

Managing FGPA Resources as Virtualized Accelerator Block.

Virtual Event | Sunday, February 27 — Tuesday, March 1, 2022.

We are excited to be a Sponsor of the 30th ACM/SIGDA International Symposium on Field-Programmable Gate Arrays (FPGA 22) — the premier conference covering advances in FPGA technology. Research papers presented include: FPGA architecture, FPGA circuit design, CAD for FPGAs, high-level abstractions and tools for FPGA design, FPGA-based and FPGA-like computing engines, and applications and design studies.

This webinar occurs several times. Please register for the date and time that works best for you.

Educate your internal teams on essential IoT security concepts and gain hands-on experience from our experts in our advanced IoT Security Labs. Our workshops will enable you to design and produce secure, sustainable IoT devices and ecosystems that will ensure your long-term success.

Bosch Sensortec GmbH is a fully owned subsidiary of Robert Bosch GmbH that develops and markets a wide portfolio of MEMS sensors and solutions tailored for smartphones, tablets, wearable devices and IoT applications. Bosch has been both a pioneer and a global market leader in the MEMS sensor segment since 1995.

Redtree Solutions and Open-Silicon, a system optimized ASIC solutions provider, will be glad to welcome you on Open Silicon’s booth at the Embedded World 2017 Nuremberg, Germany between 14 – 16 March 2017 to demonstrate the company’s Custom Silicon and Gateway Platform for Smart Cities, 2.5D SoC demo along with Comprehensive HBM2 IP Sub-System Solution.

Please visit us at booth 3-641 in exhibition hall 3 for viewing the demos and learning about company’s other innovative ASIC/SoC solutions.

1. Custom Silicon and Gateway Platform for Smart Cities – Company will be demonstrating end-to-end communication between edge devices / sensor hubs, gateway and cloud. The gateway platform is designed for smart city applications, which includes Smart Homes, Smart Waste Management, Smart Transport, Smart Traffic, Smart Parking, Smart Lighting, Smart Metering, etc. At its booth, company will be demonstrating Smart Lighting and Smart Parking in action.

2. Comprehensive HBM2 IP Sub-System Solution – The solution is now available for 2.5D ASIC design starts and as licensable Intellectual Property (IP). Open-Silicon’s IP is fully complying with the HBM2 JEDEC® standard. The IP translates user requests into HBM command sequences (ACT, Pre-Charge) and handles memory refresh, bank/page management and power management on the interface. The IP includes the PHY and custom die-to-die IO needed to drive the interface between the logic-die and the memory die-stack on the 2.5D Interposer.

3. 2.5D SoC Solution – This platform demonstrates a functional system-on-chip (SoC) solution featuring two 28nm logic chips, with embedded dual core 1GHz ARM® Cortex®-A9 ARM processors, connected across a 2.5D silicon interposer.

When and Where:
Booth 3-641 in exhibition hall 3
Exhibition Centre
90471 Nürnberg, Germany

Date & opening times:
14 – 16 March 2017
09:00 – 18:00 (14 and 15 March)
09:00 – 17:00 (16 March)

Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers. The company enhances the value of customers’ products by innovating at every stage of design – architecture, logic, physical, system, software, IP – and then continues to partner to deliver fully tested silicon and platforms. Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities. The company has partnered with over 150 companies, ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully completed 300+ designs and shipped over 125 million ASICs to date. Privately held, Open-Silicon employs over 250 people in Silicon Valley and around the world.

We are pleased to invite you as our valuable customer to come for visiting
Telechips IBC Roadshow - September 14 - 18, 2018.
Telechips CE Business unit will be looking forward to sharing Telechips’ new features that outperform
current  solutions available in the market.

World Smallest Android TV Device & Rich Solution

• Android TV Mini with Android “P” Version (Telechips in Google EAP)
• 4K Smart Stick with LTE modem
• Various 4K HDR Capability
• DVB-S2 Android Hybrid STB
• S/W Voice Recognition STB

Venue: RAI Amsterdam (Stand No. BS7)

Europaplein 2, 1078 GZ Amsterdam
+31 20 549 1212

Date: 14-18 Sept. 2018
 

We are looking forward to meeting you at the event.

We are pleased to invite you as our valuable customer to come for visiting Telechips IBC Roadshow 13 17 September, 2019.

We are pleased to invite you, our valuable customer/ business partner, to participate at Telechips CES Roadshow – January 9 ~ 12, 2018.

We are pleased to invite you, our valuable customer/ business partner, to participate at Demo Showcase of the GENIVI AMM Munich 2018 – April 18, 2018.

Redtree is pleased to announce an upcoming event with its Partner Rambus to speak about their Interface/High Speed Serdes and Security IP offer.

Les MacInnes - FAE Redtree Solutions - June 2021